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Hot Wall

 

1535

Process Probe 1535

1535 icon

  • Compare wafer temperature to profile thermocouples (1535)
  • Check wafer center-to-edge thermal stresses during loading and ramping (1535)
  • Optimize wafer pitch vs. thermal induced stress (1535)
  • Obtain thermal wafer data for optimizing model-based control parameters and evaluating the results (1535)

 

At SensArray, we pride ourselves on matching the right product with any system.

The Process Probe 1535-instrumented wafer is ideal for process temperature monitoring of hot wall systems, and oxidizing cold wall environments.

Use the Process Probe 1535 in a variety of equipment, over a wide range of temperatures from 0°C to 1100°C. With exceptional measurement accuracy, you can tighten control parameters, reduce equipment qualification time, calibrate temperature setpoints, and optimize edge to center temperature differentials to minimize wafer stress.

The ThermaBond technique, which embeds the thermocouple sensors into the silicon, delivers unprecedented measurement accuracy and optimum reliability. Durable, easy to use, and versatile, the Process Probe 1535 wafer ensures an excellent return on your investment in quality improvement.

 

Other Processes Supported
1535 Hot Wall
LPCVD Hot Wall
  RTP